Flexible, automated diagnostic solutions to help people solve circuit card problems.
RFI testing provides the confidence and certification that the maintenance action was completed. RFI testing typically ends at a net or
ambiguity group. Adding Huntron diagnostics to isolate down to the defective component completes and compliments the overall test.
Boundary Scan is a testing method that offers the advantage of structural device, board and system level access without the need for any invasive nail
fixtures common to in-circuit test. The advantage here is that it can be embedded into RFI testing.
MTR reports 38% of all repairs are made by the technician simply “seeing” the problem. New vision tools are available to help the technician “see” better
when troubleshooting and diagnosing circuit board problems.
Manual and automated visual inspection can be added to the overall test process to improve accuracy and Huntron is supporting this technology by
forming alliances with vision systems manufacturers and distributing their products.
- Troubleshoot BGAs by “seeing” through the package using FocalSpot X-ray systems
Huntron Robotic Probers, advanced software and new card level Huntron Trackers provide the cost effective integrated solution that compliments functional tests systems.
- Card level repair, automating (manual guided) probing during diagnostics increases productivity and accuracy either with the Huntron Tracker test or any other
measurement tool ( multimeter, oscilloscopes...)
- Precision probing allows access to fine pitch ICs without expensive fixturing
- Once the test is established, the need for documentation to locate probe points and to reliably make contact without error is eliminated
Huntron has established an alliance with FocalSpot Inc. to provide:
- Highly efficient Automated fine pitch and/or BGA device removal and replacement system
- Thermocouple and software control help prevent accidental damage to components and SRA boards, including complicated multi-layer boards
- System design and automation to greatly reduce technician training time for even the most complex component repairs